ASTM E1274-2003(2008) 用验平仪测量路面不平整度的标准试验方法

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【英文标准名称】:StandardTestMethodforMeasuringPavementRoughnessUsingaProfilograph
【原文标准名称】:用验平仪测量路面不平整度的标准试验方法
【标准号】:ASTME1274-2003(2008)
【标准状态】:现行
【国别】:美国
【发布日期】:2003
【实施或试行日期】:
【发布单位】:美国材料与试验协会(US-ASTM)
【起草单位】:E17.31
【标准类型】:(TestMethod)
【标准水平】:()
【中文主题词】:
【英文主题词】:graphicsurfacerecord;pavement;roughness;Graphicsurfacerecord%;Longitudinalprofile;Multi-wheeledprofilograph;Profilograph;Roughness;Surfaceanalysis--pavements;Surfaceroughnessmeasurement
【摘要】:Thistestmethodprovidesameansformeasuringtheroughnessofneworrehabilitatedpavements.Resultsmaydifferbetweenprofilographsofdifferentdesignsandthereforewillnotnecessarilyagreewithroughnessmeasurementsbyotherprofilographsorotherroughness-measuringequipment.1.1Thistestmethodcoversthemeasurementofpavementroughnessusinganarticulatedmulti-wheeledprofilographatleast23ft(7m)long(Fig.1istypical).1.2Thistestmethodutilizesasurfacerecordmadebymovingtheprofilographlongitudinallyoverthepavementatlessthan3mph(5km/hr).Therecordisanalyzedtodeterminetherateofroughnessandtoidentifybumpsthatexceedaspecifiedthreshold.1.3Thevaluesstatedininch-poundunitsaretoberegardedasstandard.ThevaluesgiveninparenthesesaremathematicalconversionstoSIunitsthatareprovidedforinformationonlyandarenotconsideredstandard.1.4Thisstandarddoesnotpurporttoaddressallofthesafetyproblems,ifany,associatedwithitsuse.Itistheresponsibilityoftheuserofthisstandardtoestablishappropriatesafetyandhealthpracticesanddeterminetheapplicabilityofregulatorylimitationspriortouse.SeeSection6forspecifichazardstatement.
【中国标准分类号】:R86
【国际标准分类号】:93_080_20
【页数】:4P.;A4
【正文语种】:英语


基本信息
标准名称:角形支臂(立柱200×200)
中标分类: 航空、航天 >> 航空器与航天器制造用设备 >> 夹具
替代情况:HB 520-65
发布日期:1976-02-04
实施日期:1975-12-01
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页数:1页
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所属分类: 航空 航天 航空器与航天器制造用设备 夹具
Product Code:SAE AMS3601
Title:Plastic Sheet, Copper Faced Glass Fabric Reinforced Epoxy Resin Hot Strength Retention
Issuing Committee:Ams P Polymeric Materials Committee
Scope:This specification covers epoxy-resin-impregnated glass laminates in the form of sheets clad on one or both sides with electrolytic copper foil. This product has been used typically in the fabrication of etched, printed circuits for electrical and electronic equipment where a combination of low moisture absorption, hot strength retention, and bond strength are required, but usage is not limited to such applications.