【英文标准名称】:Semiconductordevices-Mechanicalandclimatictestmethods-Part19:Dieshearstrengthtest
【原文标准名称】:半导体器件.机械和气候试验方法.第19部分:模剪切强度试验
【标准号】:IEC60749-19-2003
【标准状态】:现行
【国别】:国际
【发布日期】:2003-02
【实施或试行日期】:
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC/TC47
【标准类型】:()
【标准水平】:()
【中文主题词】:集成电路;半导体器件;气候试验;外壳;芯片;剪切强度;气候;环境试验;电气工程;电学测量;材料强度;电子设备及元件;试验;电子工程;元部件;机械试验;半导体
【英文主题词】:Chips;Climate;Climatictests;Components;Electricalengineering;Electricalmeasurement;Electronicengineering;Electronicequipmentandcomponents;Enclosures;Environmentaltesting;Integratedcircuits;Mechanicaltesting;Semiconductordevices;Semiconductors;Shearstrength;Strengthofmaterials;Testing
【摘要】:ThispartofIEC60749determines(seenote)theintegrityofmaterialsandproceduresusedtoattachsemiconductordietopackageheadersorothersubstrates(forthepurposeofthistestmethod,theterm"semiconductordie"shouldbetakentoincludepassiveelements).Thistestmethodisgenerallyonlyapplicabletocavitypackagesorasaprocessmonitor.Itisnotapplicablefordieareasgreaterthan10mm.Itisalsonotapplicabletoflipchiptechnologyortoflexiblesubstrates.NOTEThisdeterminationisbasedonameasureoftheforceappliedtothedieortotheelement,and,ifafailureoccurs,thetypeoffailureresultingfromtheapplicationofforceandthevisualappearanceoftheresidualdieattachmediumandtheheader/substratemetallization.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:20P.;A4
【正文语种】:英语